Copper foam is a new multifunctional material with a large number of connected or non-connected pores evenly distributed on the copper substrate. Copper foam has good conductivity and ductility. Compared with nickel foam, the preparation cost is low and the conductivity is good. It can be used to prepare battery negative electrode (carrier) materials, catalyst carriers and electromagnetic shielding materials. In particular, copper foam has some obvious advantages as the base material of battery electrodes, but because the corrosion resistance of copper is not as good as that of nickel, it also limits some of its applications.